Micron Flake Copper Powders 1-20um 99% Cu

Micron Flake Copper Powders 1-20um 99% Cu

Specifications:

Property and applicaiton of Micron Flake Cu powder:

The appearance of micron -shaped copper powder is pure, uniform color, copper -red scales -shaped metal powder. Because of its larger surface area and strong surface activity, it has the advantages of high melting points, good magnetism, conductivity thermal conductivity, good light absorption and other advantages. It has its extensive application in many fields.

Copper powder is widely used in the field of microelectronics due to its excellent conductivity, such as fillers of conductive coatings, conductive glue and plasma.
Studies have found that the appearance of copper powder has a significant impact on the conductivity of the product. Ballo -shaped copper powder is mainly contact, while the film -shaped fillers are dominated by surface contact, which is conducive to the conduction of charge, which makes the chip -like copper powder better conductive.
However, the fine copper powder is larger than the surface area, and the chemical properties are lively. It is prone to oxidation in the air, resulting in darker the color of the material and the poor decorative, and the copper oxide is an insulator. Maintain good conductive performance during the process. Therefore, how to prevent copper powder from being oxidized during the preparation stage of the material and during use is a key issue in the research of copper material application.

Flake copper powder resistance is low, partly instead of silver powder for preparation of low temperature polymer, conductive adhesive, etc., can also be made into electromagnetic shielding, anti-static products, flake copper powder is also the main material in the manufacture of the Silver coated copper powders.

The double anti-static bag or aluminum foil packing, the 100 grams, 500 grams, 1 kg, 2 kg, 5 kg. packing seal, and store in a cool and dry place, storage temperature of 0 to 25 ℃. Do not contact with Oxidant.