Flame Retardant Synergist Used Nano Grade Sb2O3 Powders

Flame Retardant Antimony Trioxide Sb2O3 Nano Powder have heat stability,soluble in acid,insoluble in water and acetic acid

Antimony Trioxide Sb2O3 Nanoparticles used as flame retardant.

Antimony Trioxide Sb2O3 nanopowders with the purity of 99.5% as the fire-resistant coating in the industry.

Nano silica (SiO2) powder has a large specific surface area and many surface active centers, and thus it has potential application value in catalysts and catalyst supports.

HONGWU Titanium Carbide nanoparticles possesses high purity, small particle size distribution, and high specific surface area.

Single-walled carbon nanotubes is widely used as hydrogen storage materials.

Hongwu Nano supply Tungsten Trioxide (WO3) nanopowder in 50nm with 99.9%purity, as well as blue, purple tungsten oxide nanopowders, cesium tungsten oxide nanopowders.

Beta SiC Silicon carbide whiskers from china factory have high dispersed metod.

Anatase nano titanium dioxide has a good photocatalytic effect and is widely used in photocatalysts and air purification products.

Diamond nanoparticles is superhard, superfine, high spec surface area, could be used to make nano diamond polishing liquid. 

Hongwu Nano supply high quality nano graphene and graphene oxide at favorable factory price and with goods and stable quality.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you