Ferritic stainless steel 430 Nanopowders, Ferritic stainless steel

99.9% Stainless Steel Nanoparticles 430 with oxidation resistance apply to powder metallurgy sintering.

Hongwu is supplying fusible alloy nano SNBI material, 200-300nm, 300-500nm, 1-3um, etc. after heating melting the alloy has good fluidity, so this kind of low melting point metal is also widely used to use the mold by casting method. Fell free to contact us at hwnano@xuzhounano.com, thank you.

 Zinc Oxide nanopowder (zno) 20-30nm,99.8% could use as the ceramic application so on.

Carbon nanotubes have SWCNTs, DWCNTs, MWCNTs, with short tube 1-2um and long tube 5-20um, high purity 91-99%. Diameter from 2nm-100nm. For longer length, they can be customized.

VO2 is a metal oxide with phase change properties,100-200nm,99.9%.

Transparent conductive ITO powder is in 50nm particle size, 99.99% purity,has high visible light transmittance.

Ultra-fine Cu2O copper oxide nanoparticles used as catalyst.

Carbon Nanotubes have excellent electrical, mechanical and thermal properties and they inevitably determine the broad application prospects in the fields of physics, chemistry, information technology, environmental science, materials science, energy technology and other sciences. Hongwu Nano has manufactured carbon nanotubes with various specifications for years.

Where to buy flake conductive copper powder? HW NANO meet your requirement about nanopowder.

99.9% Stainless Steel Nanoparticles 430 with oxidation resistance apply to powder metallurgy sintering.

High purity multi walled carbon nanotubes used as catalyst support for its excellent catalytic performance. Besides, CNTs have good properties of thermal, electronic conduction, adsorption, mechanical and are widely used in various fields.

Silicon carbide has the characteristics of corrosion resistance, high temperature resistance, high strength, good thermal conductivity, and impact resistance. At the same time, it has the advantages of high thermal conductivity, oxidation resistance, and good thermal stability. It is often used in packaging materials in the microelectronics industry.