China factory Cubic Silicon Carbide powder ( β-SiC ) for Thermal Conductive

Silicon carbide has the advantages of high thermal conductivity, oxidation resistance, and good thermal stability. It is often used in packaging materials in the microelectronics industry.

Surface modification of cubic silicon carbide (β-SiC) thermally conductive filler by chemical organic modification, and characterization of β-SiC powder after treatment by infrared spectroscopy. Modification with silane coupling agent, stearic acid and the combination of the two To study the effect of different modifiers on the solid content, oil absorption and thermal conductivity of β-SiC powder. The experimental results show that the modification effect of KH564 in the silane coupling agent is more obvious; through the treatment of stearic acid and two kinds of The study of the combined use of surface modifiers shows that the modification effect is further improved compared to a single modifier. The effects of stearic acid and KH564 are better, and the thermal conductivity reaches 1.46 W/(m·K), compared with unmodified The β-SiC is improved by 53.68%, which is 20.25% higher than the use of a single KH564 modification.

Advantages of nano silicon carbide for heat conduction:
Nano-scale silicon carbide powder can form contact heat-conducting chains, and it is easier to link with polymer to form Si-O-Si chain heat-conducting skeleton as the main heat conduction path, which greatly improves the thermal conductivity of composite materials without reducing the composite The mechanical properties of the material. The volume ratio of nano silicon carbide powder is 13.8% (the mass ratio is less than 30%), which greatly improves the thermal conductivity of epoxy resin to 4.1 W/m.K.

The thermal conductivity of the silicon carbide epoxy composite material increases with the increase in the amount of silicon carbide, and nano-silicon carbide can give the composite material good thermal conductivity when the amount is low. The flexural strength and impact strength of silicon carbide epoxy composite materials increase first and then decrease with the increase of the amount of silicon carbide. The surface modification of silicon carbide can effectively improve the thermal conductivity and mechanical properties of the composite material.

Silicon carbide has stable chemical properties, its thermal conductivity is better than other semiconductor fillers, and its thermal conductivity is even greater than that of metal at room temperature. Researchers from Beijing University of Chemical Technology conducted research on the thermal conductivity of alumina and silicon carbide reinforced silicone rubber. The results show that the thermal conductivity of silicone rubber increases as the amount of silicon carbide increases; when the amount of silicon carbide is the same, the thermal conductivity of the small particle size silicon carbide reinforced silicone rubber is greater than that of the large particle size silicon carbide reinforced silicone rubber; The thermal conductivity of silicon rubber reinforced with silicon carbide is better than that of alumina reinforced silicon rubber. When the mass ratio of alumina/silicon carbide is 8/2 and the total amount is 600 parts, the thermal conductivity of silicon rubber is the best.