Transparent Electrode Used Aluminum-Doped Zinc Oixde AZO Nanopowders

AZO nanopowder is widely used in conductive antistatic coating.

AZO Nano powder has heat resistant with excellent conductivity, high temperature stability and anti-radiation performance.

HONGWU Al-doped zno (AZO) nanopowder, is availabe in particle size 30nm, ratio with Zno:al2o3=99:1,98:2. The company is ISO 9001,ISO14001 and ISO 45001 certified and is consistently in the vanguard of  nanomaterial industry innovators.

The application of  HONGWU AZO aluminum zinc oxide nanoparticles in polyacrylic resin composite coatings can significantly improve the thermal insulation performance. Size 30nm 99.9%. Small order for researchers and bulk in industrial groups. if interested please contact us freely.

Copper oxide nanopowders has good catalytic performance, widely used in desulfurizer.

Nano-TiO2 has very valuable optical properties and has shown promising prospects in the automotive industry and in many fields. 

As the substitute of alumina ceramic roller or alloy steel roller, zirconia ceramics rolls are now widely used in high precision of processing technology roll machine in electronics, batteries and industries, are the key parts of the equipment. 

The porous, high dispersion and high activity alpha aluminum oxide nanopowders apply to the nano ceramic material.

Nano Platinic oxide Particle is good as hydrogenation catalyst. Hongwu Nano customizes high purity PtO2 nanopowder with particle size from 20nm--1um, 99.95%purity. The element type Pt nanoparticle is also available, as well as water dispersion.

Hongwu supply flake silver powder with particle size 1-15um, high purity 99.99%, and they're widely used in touch screen low temperature silver paste with excellent condution performance. Differenet apparent density and SSA are available.

Nano tungsten carbide cobalt powder, particle size is 60 nm, purity of 99.9%, the proportion of cobalt can be done 6, 10, or 12. Micron size can also be customized. It is widely used in cemented carbide.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you