Titanium Nitride Powder / TiN Powder (TiN, 99.5%, 100-200nm, Cubic)

Titanium Nitride Nanopowders has good conductive, widely used in metal ceramic materials,refractory materials.

The product has high purity, small particle size and large specific surface area. Its surface activity is high, UV shielding is more than 80%, and it has good barrier properties. The material has good electrical conductivity and can be used as a conductive material for electrodes and electrical contacts of molten salt electrolysis.

Nano titanium nitride powder is a good heat resistant materials.

Titanium nitride nanoparticles is widely used as nucleating agent on thermoplastics.

TiN nanopowder dispersed in the coating system, formed of TiN thin film which used for energy-saving glass coating.

Titanium Nitride Powders with high melting point and hardness which apply to the lubricant raw materials .

TiN Titanium Nitride Powders with good thermal conductivity and electrical conductivity, optical properties,biocompatibility.

ATO has excellent electrical and optical properties. It can be used as a good electrical conductivity and as an antistatic agent. It can be widely applied in paint, chemical, polymer film field.

Ultra fine zinc nanoparticles is widely used as efficient catalyst.

If you want to buy nickel powders including spherical nickel,flake nickel,Spiny spherical nickel, nickel nanowires and nano nickel alloy powders, please turn to Hongwu Nanomaterial, We pay special attention to the quality assurance of nickel particles and services we deliver.

Extremely low abrasive wear(ppm), preventing materials from being polluted.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you