Tin Copper SnCu Alloy Nanopowder

Good electric conductivity and light transmittance performance make nano Graphene be prospective in Lithium ion battery and transparent conductive electrode.

In yttrium-added zirconium oxide, yttrium oxide is used as a stabilizer, and this material is mainly a tetragonal structure. It has the highest flexural strength of all zirconia materials, especially when sintered and pressed. Yttrium stabilized zirconia has fine grains and is suitable for use in cutting tools due to its high wear resistance. It is used to cut a very sharp corner part. The excellent crystal grains make the produced ceramics dense, without many pores, and have excellent mechanical strength, corrosion resistance, impact toughness, thermal shock resistance and extremely low thermal conductivity. Because of these characteristics, yttrium stabilized zirconia is mainly used in wear-resistant parts, cutting tools and thermal barrier coatings.

Titanium nitride nanoparticles is widely used as nucleating agent on thermoplastics.

20nm, 50nm, 80nm Silver Nanopowders is widely used in antibacterial medicine,textile,rubber and so on.

Titanium Nitride Powders with high melting point and hardness which apply to the lubricant raw materials .

Multi-walled carbon nanotubes is widely used as reinforced polymer composite materials for its excellent mechnical properties. Besides pure CNTs, functionalized typs can be customized also.

DWCNTs Double-walled Carbon Nanotubes have excellent field emission performance, light in weight.

Ultra fine precious metal iridium(Ir) nanopowders are supplied by Hongwu nano Team, with the size of 20-30nm, high purity 99.95%, stored in deionized water. IrO2 nanopowder also available.

Rutile Titanium Doxide Nanopowders have the feature of non-toxic ,the best whiteness and the radiance apply to produce the sun cream .

Our nano zincum powder could supply in 40nm, 70nm, 100nm, 130nm with 99.9% purity, welcome to inquiry.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you

Diamond nanoparticles used as composite plating.