MoS2 Powders Molybdenum Disulfide Nanoparticles for solid lubricating materials

Superfine 20nm nano tin oxide powders is widely used in gas sensor materials.

Silver nanowires solution has super bacteria performance, is widely used in health care, textiles, plastics and chemical building materials and other products.

Nano Silver Wire have high specific surfaces areas and it is a grey materials,mainly use for transparent and other applications.

Buy 99.99% fine alpha alumina(Al2O3) powders for refractory material from Hongwu Nano. Worldwide shipping.

SiC whiskers widely used in toughening metal matrix,ceramic matrix and polymer matrix composite.

HWNANO Aluminum nitride is an excellent comprehensive performance new ceramic materials having good thermal conductivity.

Single walled carbon nanotubes can be used as supercapacitor electrode material due to its excellent properties. SWCNTs have good properties of mechanics, field emission, electromagnetic, adsorption, chemical, etc..Besides pure SWCNTs, Hongwu Nano also supply functionalized types as required.

This zirconia dental ceramic has very good properties: the chemistry corrosion proof, wear resistance and thermostability proof.

There are three kinds of common copper powder morphology: spherical, flaky and dendritic. Ultrafine dendritic copper powder is a kind of dark brown metal powder, which is widely used in catalysis, electrode materials, copper paste fillers, microelectronics industry and printed electronics technology

A growing interest in diamond nanoparticles has been shown in the resent years for biochemical sensors due to its characteristics of high surface area, high surface energy and high catalytic efficiency.

Silicon Nitride Powders have the characteristic of antioxidant and corrosion resistance which apply to the production of silicon nitride ceramics.

High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use       Conductive adhesive is a special kind of adhesion agent, mainly composed of resin and conductive fillers, such as silver powder, gold powder, copper powder, nickel powder, graphite powders, etc.), can be used as adhesive materials in microelectronics components, encapsulation manufacturing process.         Conductive adhesive with flake silver powder has excellent electrical conductivity, adhesion and chemical stability. Silver powder almost not be oxidized in the rubber, in air its oxidation speed is very slow, even if is oxidized, silver oxide generated still has good electrical conductivity. therefore, in the market, especially on the high reliability requirements of electric installation, flake silver powders as conductive filler is used mostly. And in the choice of matrix resin, epoxy resin is the best because of its high content of active group, high cohesive strength, good adhesion and excellent mechanical properties.       HW NANO flake silver powder, with particle size <1um, 1-3um,5-8um,10um, purity 99.99%. Specific surface area and apparent/bulk density are adjustable flexibly. It is available with small quantity for researchers and bulk order for industry groups.          Silver powder filling quantity influence on the properties of conductive silver glue. after silver powders as conductive filler is added to the epoxy adhesive, the conductive mechanism is the contact between of silver powders.After system curing, silver powders connect into chain circuit with each other, presents the conductivity. the data shows that the adding quantity of silver powder to 80% or so, the conductivity is the best.