Metal Indium Powder Super Fine High Purity Spherical Indium Nanoparticles

Spherical nano indium powder supplier, <100nm 99.99%+, Indium nanoparticles is widely used in the semiconductor industry.  also used to make LCD panels. for learn about Indium (In) Nanoparticles Properties and Applications,welcome to test our products.

Facory direct offer 100nm 99.99% In nanopowder. Good and stable quality, good sphericity, rich experience in exporting powder goods. And need welcome to contact us.

Facory direct offer 100nm 99.99% In nanopowder.Good and stable quality, good sphericity, rich experience in exporting powder goods.Any need welcome to contact us.

HW NANO is professional manufacturer and supplier for Antimony Tin Oxide ATO Nanoparticles.

Hexagonal boron nitride nanoparticles is widely used as ceramic materials.

Titanium powder has long been used as an alloying additive for a variety of applications.

Nano titanium nitride powder is a good heat resistant materials.

Factory directly sale 100-200nm nano WC tungsten carbide powder with best price.

Spherical nano indium powder supplier, <100nm 99.99%+, Indium nanoparticles is widely used in the semiconductor industry.  also used to make LCD panels. for learn about Indium (In) Nanoparticles Properties and Applications,welcome to test our products.

Major applications of nano gold dispersion include, but are not limited to cell detection, microscopic tracers, specular gold and silver staining, western blotting, biosensors, biochips, drug residue detection, gene-regulated drug synthesis, drug transport, and photochemotherapy.

Hongwu International Group Ltd supply SnO2 nanopowder with the size of 20nm, 30nm, 70-80nm with 99.99%purity.  Antimony Doped Tin Oxide(ATO) nanopowder is also available.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you