Hydrophilic Hydroxyl group modified multiwalled carbon nanotubes Hydroxylated MWCNT

Hydrophilic Hydroxylated Multi-Walled Carbon Nanotubes(MWCNT-OH) would be better dispersed in water base. Besides hydroxyl functional group, carboxy, amino groups can be customized also.

Hydrophilic Hydroxyl group modified multiwalled carbon nanotubes Hydroxylated MWCNT is a customized material. The functional groups(-OH, -COOH, -NH2) and other modification can be specified as per different applications.

factory directly price Zirconia ceramics butterfly valve

      Titanium dioxide material can selectively etch metal nanoparticles through electron transfer with metal Ag nanoparticles in the excited state, and change the optical absorption characteristics of the material, thus the Ag/Tio2 nanomaterials can change color under the light excitation of different wavelengths.       Experimental demonstration: 1) 500 ℃ heat treatment was carried out on the TIO2 thin film，it is helpful for photocatalytic deposition of Ag particles, and Ag/TIO2 thin film has the obvious photochromic phenomenon; 2) as the content increase of Ag particles deposited on TIO2 films, the photochromic rate of Ag/TIO2 films increases correspondingly, but the reaction rate of photochromic reaction is inhibited when the content of Ag particles exceeds a certain amount.       If you're interested in the material, please not hesitate to contact us , and we will make a tailor for matching your products.

Hongwu International Group Ltd supply both 20nm-1um iridium/Ir and iridium dioxide nanopowders with 99.99% purity.

Superfine high purity tin oxide SnO2 nanoparticles is a semiconductor materials.

Single-walled Carbon Nanotube SWCNTs Functional Groups Grafting,Tubes as matrices.

Water soluble nano sio2 powders is widely used for silicon fertilizer in agriculture.

For the silver nanowires, we could not only supply powder form,but also could supply in dispersion, solvent could do it according to customer required.

Violet Tungsten Oxide is key material of manufacting super-fine Tungsten powders and Tungsten Carbide nanopowders.

Fullerene C60 nanoparticles used for photoconductor in photocopier.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you