High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use

High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use

      Conductive adhesive is a special kind of adhesion agent, mainly composed of resin and conductive fillers, such as silver powder, gold powder, copper powder, nickel powder, graphite powders, etc.), can be used as adhesive materials in microelectronics components, encapsulation manufacturing process.

      Conductive adhesive with flake silver powder has excellent electrical conductivity, adhesion and chemical stability. Silver powder almost not be oxidized in the rubber, in air its oxidation speed is very slow, even if is oxidized, silver oxide generated still has good electrical conductivity. therefore, in the market, especially on the high reliability requirements of electric installation, flake silver powders as conductive filler is used mostly. And in the choice of matrix resin, epoxy resin is the best because of its high content of active group, high cohesive strength, good adhesion and excellent mechanical properties.

      HW NANO flake silver powder, with particle size <1um, 1-3um,5-8um,10um, purity 99.99%. Specific surface area and apparent/bulk density are adjustable flexibly. It is available with small quantity for researchers and bulk order for industry groups. 

      Silver powder filling quantity influence on the properties of conductive silver glue. after silver powders as conductive filler is added to the epoxy adhesive, the conductive mechanism is the contact between of silver powders.After system curing, silver powders connect into chain circuit with each other, presents the conductivity. the data shows that the adding quantity of silver powder to 80% or so, the conductivity is the best.