Cu Electronic Paste, Copper Slurry used Copper Powder Micron Size

                          Cu Electronic Paste, Copper Slurry used Copper Powder Micron Size

Cu powder used for slurry: Cu electrode paste has been developed mainly divided into three types: the glass-containing, added to the oxide-free glass, while the Cu electrode paste containing glass and oxides. Also make sure the surface of Ni metal particles not oxidized at a high temperature burning conditions. The current anti-oxidation technology mainly: Cu powder the surface of silver, the reducing agent slurry was added, the organic phosphorus compound Cu powder processing, dilute polymer solution treatment, coupling treatment and the like.

We could also supply nickel powder and zinc powder,which widely used in slurry:

Ni powder for slurry: Ni has good electrical conductivity, chemical stability and weldability, which is the main factor in determining the performance of an electrode slurry. Ni conductive paste is an ideal thick film conductive paste, but to ensure that the surface of Ni metal particles not oxidized at high temperature burning conditions, and high temperature sintering Ni powder sintered metal formed network structure, but with lower combined strength of the ceramic substrate, only by glass bonding.

Zn powder for slurry: usually the fine Zn powder, lead borosilicate glass frit in an organic binder to a certain percentage of the traditional method dubbed slurry. Zn powder can be used as an electrode material PTC thermistor, instead of Ag conductor paste can also greatly extend the life of a plasma display panel.