Single layer reduced nano graphene oxide powder china supplier

Graphene Oxides contains many funtional groups, has good dispersed properties, ,mainly used in composite materials.

Black graphene oxide as the catalytic materials apply to the chemical industry.

Nano composite material graphene oxide nanopowder have excellent adsorption ability for heavy metal.

Graphene oxides contains many hydrophilic groups, is easily dispersed in water.

Graphene is an entirely new material with unique properties: it conducts electricity as well as copper, and it conducts heat better than any known material, has a wide range of application prospects.

Industrial  nano Gaphene oxide powders with both single layer and multi layer at offer.  It has the advantages of large specific surface area, excellent physical and chemical properties, and easy to combine with other materials through surface functional groups, etc.

Graphene is a new material in which carbon atoms connected by sp² hybridization are tightly packed into a single-layer two-dimensional honeycomb lattice structure. Graphene has excellent optical, electrical, and mechanical properties, and has important application prospects in materials science, micro-nano processing, energy, etc., and is considered to be a revolutionary material in the future.

Graphene oxide has excellent physical, chemical, optical, and electrical properties, and is a new type of carbon material with excellent performance, with high specific surface area and abundant functional groups on the surface. Graphene oxide composites, including polymer composites and inorganic composites, have broad application prospects.

Nano graphene oxide powder single layer GO powders, China factory direct offer, favorable price. thickness:0.6-1.2nm,Length:0.8-2um,99%

Because of its structure, graphene oxide has many excellent properties and can be widely used in many fields, such as energy storage, catalysis, batteries and nanocomposites, with good performance. Hongwu's single layer graphene oxide, GO nanopowder

With β-Sic do electronic packaging materials, heaters, heat exchangers have high thermal shock resistance, good thermal conductivity,

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you