HWNANO Aluminum nitride is an excellent comprehensive performance new ceramic materials having good thermal conductivity.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you

Silicon oxide nano powders (SiO2,20NM,99.8%,Amorphous) Silicon oxide nano powders as the amorphous white powder, is a kind of non-toxic, tasteless, no pollution non-metallic materials. silicon oxide nano powders modification: 1. Alcohol, acid modification Experiments showed that alcohol and acid compounds will react with a large number of -OH of silicon oxide nano powders surface, so organic groups are grafted in the surface of nanoparticles, and the hydrophobic properties of the modified powders got improved, so as to improve the compatibility of the nano powders and organic matter 2. Surfactant modification 1) by physical adsorption surfactant is adsorbed on the surface of nanoparticles; 2) certain groups of surfactant react with -OH of the surface of the particles,which achieve the goal of the surface modification of the particles. 3. The silane coupling agent modification Experiments show that the coupling agent reduce the interaction between particles, and influence degree of different coupling agent on the modified samples is different. Stock# M600 and M602: hydrophilic SIO2, 10-20NM and 20-30NM,99.8% Stock# M603 and M606: hydrophobic SIO2,10-20NM and 20-30NM,99.8%                        1kg per bag for sample, 10kg per bag for the hydrophilic, 5kg per bag for the hydrophobic The main application of silicon oxide nano powders       HONGWU NANO silicon oxide nano powders, more than 8 years of market and technology development, has been widely used in electronic packaging materials, polymer composite materials, plastics, coating, rubber modified, paint, ceramics, adhesive, glass fiber reinforced plastic, drug carrier, cosmetics and sterilization field, which bring epoch-making significance for an upgraded version of a traditional product.

Silicon Carbide (SiC) Nanopowder / Nanoparticles (SiC, beta, 99%, 50nm, cubic)   Technical parameters of Silicon Carbide (SiC) Nanopowder / Nanoparticles： Particle size: 50nm, 100nm, 500nm, 100-200nm, 0.5um, 1-2um, 5um, 7um, 10um, 15um Purity: 99% Note: Other size specifications of the products, we can provides customized production. Decomposition Temperature: 2973k Thermal Expansion Coefficient: 6.58x10-6 at 373k Thermal Expansion Coefficient: 2.98x10-6 at 1173k Compressibility Coefficient: 0.21x10-6 Density (288k): 3.216 g/cm3 Hardness: 9.5 Mohs Heating Power (KJ/mol): 30.343   Characteristics of Silicon Carbide (SiC) Nanopowder / Nanoparticles： 1. Beta SiC powder has high chemical stability, low thermal expansion coefficient, high thermal conductivity, resistance temperature characteristics is opposite to metal; 2  Beta SiC powder has high hardness, with Mohs hardness of 9.5, next to the dismond, is the wear-resisting material; 3. Beta SiC powder has high temperature resistance, corrosion resistance, resistance to acid and alkali solvent 4. Beta SiC powder has good toughness, superior grinding performance, excellent thermal conductivity of electricity.   Application fields of Silicon Carbide (SiC) Nanopowder / Nanoparticles：       As modified high strength nylon material: nano Beta SiC powder has good compatibility dispersion in polymer composites, and good basic associativity, after modified the strength of nylon alloy tensile is 150% higher than ordinary PA6, wear-resisting performance increased more than three times. Mainly used for the armored tracked vehicle polymer parts, automotive steering parts, textile machinery, mining machinery lining board.       As modified special engineering plastics polyether ether ketone (PEEK) wear-resisting performance: when adding quantity is approximately 5%, can greatly improve and raise the wearability of PEEK (increased by more than 30%)         More information, pls contact us at hwnano@xuzhounano.com. by Alisa

HW NANO aluminum nitride, ALN, particle size includes:100-200nm,300-500nm,1-2um,5-10um. Packing: 100g, 500g, 1kg or as needed.

Best Conductive Material Antimony Doped Tin Oxide(ATO) Nanoparticles from Hongwu has been exported to many countries and regions.

Hongwu International Group Ltd supplys MgO nanopowder in 30-50nm with 99.9%purity. High quality, favorable price and good service, you deserve it! Pls contact us now!

Heat-conducting alumina can be widely used in different materials such as silica gel, sealing adhesive, epoxy resin, plastic, heat-conducting rubber, heat-conducting plastic, silicone grease. In practical application, Al2O3 powder filler can be used alone or mixed with other fillers such as AIN and BN.

hydrophobic Nano Silica/Silicon dioxide/SiO2 powder Oil soluble nano Silica/Silicon Dioxide/SiO2 used for coating/dope/painting

Polyhydroxylated & Polyhydric & Polyhydroxy fullerene --- fullerols with good water solubility, you can buy it at a amazing price for hwnanomaterial.

High thermal conductive alpha aluminum oxide nanopowders apply to the nano ceramic material.

Silicon carbide whiskers can be used for reinforcement and toughening of composite materials, as well as thermal conductive fillers and oxidation resistant coatings.