1-20um Adjustable Bronze Red Flake Copper Powders Cu

Batch supply 1-20um adjustable high purity dendritic electrolytic copper powders. 

Micron sized atomized copper powders such as electrical and thermal conductivity, morphology, chemical reactivity give various use.

Sub-micron ultra-fine copper powder with particle size 200nm, 500nm, 800nm, 99% purity, spherical.

In the machining industry, sub-micron ultra-fine copper powder is very easy to combine with iron, aluminum and other metal materials alloyed materials, as a wear-resistant repair material.

Copper is the basis of functional powder material of high-tech and high value-added, but also one of the fastest developing areas of materials hot products.

HW NANO is manufacturer of high quality Copper Powder. The product have different sizes from nano to micron,and powder color is different as per its size. the copper powder are spherical and very homogeneous. It's electrical and heat conductive and protected from oxidation and corrosion.

Where to buy flake conductive copper powder? HW NANO meet your requirement about nanopowder.

Hexagonal or amorphous nano aluminum nitride powders is widely used as aluminum nitride ceramic crucibles.

Hongwu International Group Ltd supply iron oxide nanopowders including Fe2O3 and Fe3O4. 100-200nm Fe2O3 and Fe3O4 nanopowders with 99%purity.

High Purity Conductive Nano Al Aluminum Powder with 100nm, 200nm 99.9% purity use as the catalyst.

20nm, 50nm, 80nm Silver Nanopowders is widely used in antibacterial medicine,textile,rubber and so on.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you