Commonly used thermal conductive materials are: auminum oxide nanopowder, zinc oxide nanopowder, magnesium oxide nanopowder, aluminum nitride, boron nitride, silicon carbide and so on.
Alumina Al2O3 has the advantages of thermal conductivity and insulation, and can be used as a thermally conductive filler to prepare thermally conductive insulating glue, potting glue and other polymer materials. Compared with other fillers, although the thermal conductivity of alumina is not the best, it can basically meet the basic thermal conductivity requirements. In addition, the price of alumina is relatively low, and the source is relatively wide. It is an economical and suitable filler for high thermal conductivity insulating polymers.
Hongwu Nano can produce white alumina micron powder in batches, with narrow particle size distribution, stable process and high thermal conductivity. According to customer feedback, the thermal conductivity can reach between 3-10W/(m*K) according to different filling amounts.
The particle size of alumina powder used for thermally conductive fillers is 1um, 500nm, 300nm, 200nm. The bulk price is more cost-effective.
Thermally conductive alumina can be widely used in different materials such as silica gel, potting glue, epoxy resin, plastic, rubber thermal conductivity, thermal conductive plastic, silicone grease, heat dissipation ceramics, etc. In practical applications, Al2O3 powder filler can be used alone or mixed with other fillers such as AIN and BN.
In order to improve the dispersibility of the alumina powder, the surface of the alumina can be modified with a silane coupling agent or hexadecyltrimethoxysilane.
If you want to know more about the thermal conductivity of alumina, please feel free to consult online at any time!