Silicon carbide (HW-D507) is produced by smelting quartz sand, petroleum coke (or coal coke), and wood chips as raw materials through high temperature in resistance furnaces. Silicon carbide also exists in nature as a rare mineral— named as moissanite. In high technology refractory raw materials such as C, N, B and other non-oxide , silicon carbide is the most widely used and the most economical one.
β-SiC powder has properties such as high chemical stability, high hardness, high thermal conductivity, low thermal expansion coefficient and so on. Therefore, it has excellent performances such as anti-abrasion, high temperature resistance and thermal shock resistance. Silicon carbide can be made into abrasive powders or grinding heads for high-precision grinding and polishing of materials such as metals, ceramics, glass and plastics. Compared with traditional abrasive materials, SiC has high wear resistance, hardness and thermal stability, which can effectively improve processing accuracy and efficiency. In addition, it has excellent chemical resistance and high-temperature stability, so it has a wide range of application prospects in various fields.
SiC can be used to prepare polishing materials, which has a wide range of applications in mechanical engineering, electronic devices, optical devices and other fields. This polishing material has excellent properties such as high hardness, high wear resistance and high chemical stability, which can accomplish high quality polishing and grinding operations. At present, the main grinding and polishing materials is diamond in the market, and its price is tens or even hundreds of times of β-Sic. However, the grinding effect of β-Sic in many fields is no less than diamond. Compared with other abrasives of the same particle size, β-Sic has the highest processing efficiency and cost performance.
As polishing and grinding material, nano silicon carbide also has excellent low friction coefficient and excellent optical properties, which are widely used in microelectronic processing and optoelectronic device manufacturing. Nano silicon carbide polishing and grinding materials can achieve extremely high polishing capabilities, while controlling and reducing surface roughness and morphology, improving the surface quality of the material and the performance of the product.
In resin-based diamond tools, nano silicon carbide is an important additive that can effectively improve the wear resistance, cutting and polishing performance of resin-based diamond tools. Meanwhile, the small size and good dispersion of SiC can improve the processing performance of resin-based diamond tools by mixing well with resin-based materials. The process of nano SiC for manufacturing resin-based diamond tools is simple and easy. Firstly, nano SiC powder is mixed with resin powder in a predetermined ratio, and then heated and pressed through a mold, which can effectively eliminate the uneven distribution of diamond particles by using the uniform dispersion property of SiC nanoparticles, thus significantly improving the strength and hardness of the tools and extending their service life.
In addition to the manufacture of resin-based diamond tools, silicon carbide nanoparticles can also be used in manufacturing various abrasives and processing tools, such as grinding wheels, sandpaper, polishing materials, etc. The application prospect of nano silicon carbide is very broad. With the increasing tendency of various industries to use high performance and high quality processing tools and abrasives, nano silicon carbide will certainly produce more and more extensive applications in these fields.
In conclusion, nano silicon carbide powder has a wide application prospect as a high quality polishing material. With the continuous progress of science and technology, nano silicon carbide and resin-based diamond tools will be continuously improved and upgraded to a wider range of fields.
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