Electronic paste is made by mixing functional materials with conductive binders or dispersants. It usually has a high concentration of solid particles dispersed in a stable liquid medium for easy coating, spraying, printing, and other operations in the manufacturing process of electronic devices. Its main applications are in printed electronics, solar cells, and nano electronic devices. The following are several main functional materials used for preparing electronic pastes:
- Metal powder: Metal powder is commonly used as a conductive material in electronic pastes, including silver powder, copper powder,silver copper powder, aluminum powder, etc. They have good conductivity and can be used to prepare conductive components and electrodes.
- Oxide powder: Oxide powder is commonly used as a dielectric or semiconductor material in electronic paste. For example, ZnO(HW-Z713)powder, TiO2(HW-T681,T685,T689)powder, lithium niobate powder can be used to prepare insulation layers or semiconductor materials for electronic components.
- Semiconductor nanoparticles: It isa type of material with special electrical and optical properties, often used for specific functional applications in electronic pastes. For example, indium tin oxide (ITOHW-V751) nanoparticles are widely used in the preparation of transparent conductive films.
- Carbonnano materials powders: Carbon based materials such as graphene powder （HW-C963, C966, C968) and carbon nanotubes have excellent conductivity and mechanical properties, and can be used to prepare high-performance electronic devices.
- Functional additives: In addition to the main functional materials mentioned above, auxiliary functional additives like surfactants, antioxidantsand rheological modifiers are often added to electronic paste to improve their performance and stability.
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