Learn about Thermally Conductive Aluminum Nitride(ALN)

Introduction:
Aluminum nitride AlN is the only stable compound of Al and N, and is the semiconductor with the largest energy gap in the III-V group. Aluminum nitride atoms are combined by covalent bonds, which have good chemical stability and high melting point. At the same time, it has high mechanical strength and good electrical insulation properties. It is a piezoelectric material. It has good injection molding properties, can be used in composite materials, has good matching with semiconductor silicon, good interface compatibility, and can improve the mechanical properties and thermal conductivity and dielectric properties of composite materials.

Product advantages:
The particle size distribution is concentrated,
Good dispersion,
Low metal impurity content,
Low oxygen content,
Low coefficient of thermal expansion,
Strong hydrolysis resistance.

The particle size is complete (nano-level aluminum nitride 100-200nm, 300-500nm, 1-2um, 3-5um, 10um, etc.), and surface treatment can be done according to customer requirements.

Application direction of thermally conductive aluminum nitride powder:
Special for CPU thermal silica gel system;
Special for plastic system;
Special for epoxy resin system;
High thermal conductivity filler of thermal grease and thermal grease;
High thermal conductivity filler of thermal conductive glue, thermal conductive silicone sheet, epoxy resin thermal conductive potting glue;
High thermal conductivity filler of thermally conductive engineering plastics;
Packaging materials, high temperature lubricants, adhesives;
High thermal conductivity fillers for radiators, heat-dissipating paints, and heat-dissipating inks;
Manufacture of insulating and thermally conductive fillers for high thermal conductivity integrated circuit substrates (MCPCB, FCCL);
High thermal conductivity filler of thermal interface material (TIM);
Crucible metal smelting, evaporation boat, ceramic cutting tools, cutting tools, microwave dielectric materials;
Manufacturing high thermal conductivity aluminum nitride ceramic substrates and various ceramic products.

Aluminum nitride ALN powder should be sealed and stored in a dry and cool environment. It should not be exposed to the air for a long time to prevent agglomeration due to moisture, which will affect the dispersion performance and use effect. Surface treatment can be done according to user requirements.

If you need further inquiries about aluminum nitride powder, you can consult our sales staff online.