Heat Resistant Materials Nano Titanium Nitride TiN Powder

                                         Heat Resistant Materials Nano Titanium Nitride TiN Powder

1. L571, 30-50nm, 99.5%

2. L572, 100-200NM, 99.5%

3.  L573, 1-3um, 99.5%

The application for nano titanium nitride powder:

1. Titanium nitride nanopowder has a highmelting point, high hardness, high chemical stability and excellent thermalconductivity properties.

2. Nanometer titanium nitride applied to theplastic barrier packaging materials, solve application yellowingcharacteristics: the use of nano-TiN barrier composite materials technology,Nano-TiN composite resin to form a composite material, these nanoparticles canblock the molecular gap the gas diffusion is difficult to penetrate, thusimproving the resin, plastic barrier

3. Application of PET plastic in: a small amountof nano titanium nitride powder with thermoplastic engineering plastics such asPET, PA, etc., can be used as a crystal nucleating agent, and nano titaniumnitride dispersed in ethylene glycol formulated into nano slurry polymerizationby way of the nano titanium nitride and better dispersion in the PET plastic,can greatly accelerate the rate of crystallization of PET plastic, easy toshape, to expand the scope of application of PET plastic.

4. High nitrogen content of nano TiN coatingpowder as a key material used in high-temperature heat emissivity coatingmaterials developed by adding the component coating materials using plasmaspraying technique of preparation: Application heat emissivity coating, detectedthermal radiation rate performance greatly improved, the products are mainlyused in high temperature furnace energy, military and other areas.

5. The development of lead-free soldermaterials, the incorporation of trace titanium nitride nanopowder in tin,silver, copper, zinc and other alloys, the melting temperature lower 200 ℃,generate more uniform alloy, reduce the temperature of 30 ℃oxide solid solution , both to achieve the original tin solder temperature, ifwe can further improve wettability, ie to solve the difficulty of the largestapplication of existing lead-free solder;

6.  Greenelectronic materials can not be used for preparing lead, cadmium, chromium andother harmful elements expensive, high-temperature bonding glass with lead,cadmium ceramic dielectric, glass frit and other problems are encapsulatedsolid-phase synthesis temperature, high softening point, a porcelaintemperature high, if they can trace titanium nitride nanopowder added to makethe solid phase reaction temperature is lowered 200 ℃,even lower 50 ℃, be able to use the existing processequipment, is also a big breakthrough

6. Pollution Act restrictions bromine (Br),using benzene polymer, to the electronic flame retardant, plastic shellskeleton brings challenges, if you add a small amount of plastic in the siliconnitride, silicon carbide, titanium nitride, titanium carbide nanopowders, notonly to increase the mechanical strength, abrasion resistance, heat resistanceand other properties, such as to replace brominated flame retardant propertiesof the elements, the application of organic polymer is a big breakthrough;

7. Applications in other areas: in the electrodecatalyst nano-composite hard tools, carbide, high temperature ceramicconductive materials, heat-resistant materials, dispersion strengthenedmaterials, etc., can also be applied to fuel cells, anti-static and conductiveceramic material the.